Abstract
We investigated resist profile dependence on Exposed Area Ratio (EAR). Using high activation type chemically amplified positive resist, profile changed from T-top to rounded profile with increasing EAR. We thought that this profile change was caused by acid evaporation and re- sticking. To estimate the effect of re-sticking acid, we performed resist sandwich tests. We measured resist thickness loss after PEB and observed resist profile change caused by re-sticking acid. The results thereby obtained suggest the model we propose. To reduce acid evaporation and re-sticking, we tried to use an overcoat layer. The overcoat layer was found to reduce acid evaporation and be useful for reducing resist profile dependence on EAR.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
