Abstract
With SMD‐Technology, the first purpose of plated‐through holes—to fix the components to the board—is no longer relevant. The utilisation of blind vias, preferably in combination with buried vias, results in an extremely high interconnection and packaging density and in most cases in fewer signal layers. Technology problems like drilling with precisely controlled Z‐axis as well as through‐plating of blind vias have been overcome. Reliability tests have shown a substantially lower failure rate in thermal cycling tests for DENSTRATE® multilayers.
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