Abstract
Abstract Sintering of fine silicon powder was studied under controlled water vapor pressures using the Temperature–Pressure–Sintering Diagram approach. The water vapor pressure surrounding the sample was deduced from thermogravimetric analysis and related to the water content of the incoming gas flux with a simple mass transfer model. The thickness of the silica layer covering silicon particles was then monitored by the water vapor pressure and the microstructure evolution and densification during sintering could be controlled. Stabilizing the silica layer indeed inhibits grain coarsening and allows better densification of the compacts under humidified atmosphere as compared to dry atmosphere.
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