Abstract
Ultrafine-grained (UFG) materials can effectively solve the problem of size effects and improve the mechanical properties due to its ultra-high strength. This paper is dedicated to analyzing the deformation behavior and microstructural evolution of UFG pure copper based on T-shape upsetting test. Experimental results demonstrate that: the edge radius and V-groove angle have significant effects on the rib height and aspect ratio λ during T-shape upsetting; while the surface roughness has little effect on the forming load in the first stage, but in the second stage the influence becomes significant. The dynamic recrystallization temperature of UFG pure copper is between 200 °C and 250 °C.
Highlights
Evolution of T-Shape Upsetting TestThe sharp rise of Micro System Technology (MST) and Micro Electro MechanicalSystems (MEMS) has driven the current industrial development towards miniaturization even microminiaturization [1]
When using traditional plastic processing to produce micro parts, there is an obvious size effect due to the grain size being comparable to the size of the micro part [4], which would affect the final dimensional accuracy of the formed part in actual production, leading to higher costs and lower production efficiency
Studies have shown that the above-mentioned drawbacks can be significantly ameliorated when using ultrafine-grained materials [5,6], which paves the way for the development of micro-forming technology
Summary
Systems (MEMS) has driven the current industrial development towards miniaturization even microminiaturization [1]. Due to the benefit of bulk production, considerable investigations were conducted in micro forming over recent decades [11,12] to investigate the deformation behavior and friction factor of metals, mainly including ring compression, double-cup extrusion and spike forging test [13,14]. These tests each have its advantages and shortcomings, which can’t reflect the actual cold forging process. An analysis on the relationship between forming condition and deformation behavior, viewed from the microstructural evolution, would be possible to achieve a more substantial improvement to fabricate corresponding micro components with high quality
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