Abstract

The effect of Cu2+ in bulk solution on pitting corrosion resistance of extra-high-purity type 316 stainless-steel was investigated. Pitting occurred in 0.1 M NaCl-1 mM CuCl2, whereas pitting was not initiated in 0.1 M NaCl. Although deposition of Cu2+ on the surface occurred regardless of a potential region in 0.1 M NaCl-1 mM CuCl2, Cu2+ in bulk solution had no influence on the passive film formation. The decrease in pitting corrosion resistance in 0.1 M NaCl-1 mM CuCl2 resulted from the deposited Cu or Cu compound and continuous supply of Cu2+ on the surface.

Highlights

  • The effects of alloyed Cu on the corrosion resistance of stainless-steels are complex and depend on both the corrosion environment and Cu content

  • On thewere specimen were characterized of field emission scanning electron microscopy (FE-SEM)/EDS

  • No pitting occurred on 316EHP stainless-steel in 0.1 M NaCl

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Summary

Introduction

The effects of alloyed Cu on the corrosion resistance of stainless-steels are complex and depend on both the corrosion environment and Cu content. In H2 SO4 environments, alloyed Cu has been found to enrich in the near surface [1,2,3] and to suppress the active dissolution of stainless-steels [4,5,6,7]. In chloride environments, alloyed Cu is both beneficial and harmful to the pitting corrosion resistance of stainless-steels. If stainless-steel contains sufficient amount of alloyed Cu, pitting initiation caused by the dissolution of. MnS inclusions is inhibited by a protective Cu compound layer. It has been reported that the interface between the inclusion and matrix are preferred to initiate the pitting on the Cu-containing duplex stainless-steel [11]

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