Cusp-to-cusp transfer gate using folded minor loop organization for ion-implanted bubble devices

Abstract

Ion-implanted bubble devices using the folded minor loop organization have been developed to relax spatial restrictions on function pattern design and improve the reliability of gate conductors. A cusp-to-cusp transfer gate using this organization has been designed in which bubbles are transferred between the cusps of the propagation patterns of the major line and minor loops. A 180° inside turn has also been designed in order to realize the folded minor loop organization. Test chips incorporating 4 μm period devices with the folded minor loop organization have been fabricated and characterized for a 100 kHz triangular drive field.