Abstract
AbstractThe curing process of silver‐filled glues can be traditionally monitored through thermomechanical measurements such as differential scanning calorimetry (DSC). This technique is useful for the control of the polymerization and other chemical reactions mainly involving the organic moiety of the glue. However, it is not useful to ascertain whether good electrical conduction paths are established between all the conductive filler particles as expected at the end of the curing process. In this paper, we propose a method for the control of the surface electrical conductivity of a commercial silver‐filled glue, based on the charging‐up phenomena occurring in ESCA spectroscopy. Copyright © 2006 John Wiley & Sons, Ltd.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.