Abstract
Full implementation of the new generation of lead-free solders requires detailed knowledge and understanding of their mechanical behavior. This paper reports on structure, thermal and tensile creep properties of Sn–5 wt.%Sb, Sn–5 wt.%Sb–3.5 wt.%Ag, and Sn–5 wt.%Sb–1.5 wt.%Au lead-free solder alloys. The results show that the microstructure of Sn–5Sb alloy is characterized by the presence of cubed intermetallic compound (IMC) of SbSn particles (<5 μm) within β-Sn matrix. The two ternary alloys exhibit additional constituent phases of IMCs Ag 3 Sn for Sn–5Sb–3.5Ag and AuSn 4 for Sn–5Sb–1.5Au alloys. Attention has been paid to the role of IMCs on creep behavior. The tensile creep tests were performed within the temperature range 25–130 °C at constant applied stresses. Activation energy ( Q ) and stress exponent ( n ) were determined to clarify the deformation mechanism. This study revealed that the solder alloy Sn–5Sb–1.5Au have potential to gave a good combination of higher creep resistance and rupture time, lower melting temperature and higher fusion heat compared with the other two alloys.
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