Abstract
In this study the creep deformation and rupture characteristics of a wire-drawn Cu-20%Nb composite are investigated at 500°C and compared with the results obtained from pure copper. The results show that the creep rupture strength of Cu-20%Nb is considerably higher than that for pure copper. The rupture strength of Cu-20%Nb increases up to a certain draw ratio, in contrast to the room temperature strengthening. The stress exponents n are in the range 6.6–8.1 for Cu-20%Nb, in comparison with 2.75 in pure copper. The increase in the creep strength and the higher stress exponent values in the Cu-20%Nb are associated with the reduction in the power law creep damage mechanism. This is due to the constraint introduced on the matrix creep flow by the niobium phase rather than the development of high threshold stress values. While the increase in the length of niobium filaments and reduction in interfilament spacing with increasing draw ratio increase the constraint on the creep flow of the matrix, they also enhance the creep damage caused by the diffusion mechanisms because of the easy diffusion paths along the niobium filaments and the reduction in the matrix gain size.
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