Abstract
Structural analysis of consumer electronic devices such as phones and tablets involves Finite Element Analysis (FEA). Dynamic loading conditions such as device dropping and bending dictate accurate FEA models to reduce design risk in many areas. The solid elements typically used in structural analysis do not have integration points on the surface. The outer surface is of most interest because that is where the cracks start. Analysts employ a post processing trick through using membranes to bring accurate stress/strain results to the surface. This paper explains numerical issues with implementation of membranes and recommends a methodology for accurate structural analysis.
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