Copper Diffusion Rates and Hopping Pathways in Superionic Cu <sub>2</sub>Se: Implications for Thermoelectricity

Abstract

The ultra-low thermal conductivity of Cu2Se is well established, but there is so far no consensus on the underlying mechanism. One proposal is that the fast-ionic diffusion of copper suppresses the acoustic phonons. The diffusion coefficients reported previously, however, differ by two orders of magnitude between the various studies and it remains unclear whether the diffusion is fast enough to impact the heat-bearing phonons. Here, a two-fold approach is used to accurately re-determine the diffusion rates. Ab-initio molecular dynamics simulations, incorporating landmark analysis techniques, were closely compared with experimental quasielastic/inelastic neutron spectroscopy. Reasonable agreement was found between these approaches, consistent with the experimental coefficient of 3.1 ± 1.3 10-5 cm2.s-1 and an activation barrier of 140 ± 60 meV. The hopping mechanism includes short 2 A hops between tetragonal and interstitial octahedral sites. This process forms dynamic Frenkel defects, however, there is no indication of additional broadening in the density-of-states indicating the intrinsic anharmonic interactions dictate the phonon lifetimes.