Abstract
The oxidative dissolution of copper in acidic, aqueous media is limited in rate by the presence at the metal‐solution interface of a growing film of cuprous oxide. A brief survey of what is known about the nature and modes of growth of such films provides the basis for a “duplex film” model of the corroding copper system. This leads to an interpretation of some features of the observed kinetics of the corrosion reactions reported in the preceding paper, including the constancy of rates of dissolution and film growth following induction periods, the kinetic link between them, the absence of effects due to concentration polarization of dissolved oxygen, and the results of “replacement experiments.” The interpretation is made in terms of the operation of a hypothetical double electrochemical cell, corresponding with the duplex film model, and leaves unresolved problems associated with possible special functions of carbon dioxide and the mechanism of oxygen reduction.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
