Abstract
The reliability of electrical contacts is now the major challenge to improve the lifetime of Micro Electro Mechanical Switches. This paper investigates contact failure due to material transfer in real MEMS devices. The mechanisms of degradation observed on components have been reproduced with a good correlation on an AFM-based setup. Therefore, the importance of the closure phase and the voltage applied across the contact on the material transfer phenomenon has been highlighted with a fine quantitative analysis of the transferred volume.
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