Abstract
Glass die are one of the materials used by semiconductor plants during production of specialized quad-flat no-leads (QFN) products. With its transparent appearance and fragile characteristics, several challenges are encountered and analyzed to resolve unwanted issues and to have a robust process manufacturing. This paper will discuss a potential concept of process improvement on the side of the device’s manufacturing with pattern recognition capability as detection and identification of the material to be processed. The paper will also discuss different options that can be selectively considered with respect to the manufacturer’s capability of their process flow.
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