Abstract
Due to the poor compatibility between the reinforcement and Cu matrix, interfacial bonding is of vital importance for the comprehensive properties of graphene nanoplatelets (GNPs)/Cu matrix composites. Herein, we reported a novel hybrid reinforcement with pea-pod structure (surface protruding structure of GNPs) prepared via in situ synthesis, which contributed to the dramatically ameliorated interfacial structure of the composites and regulated the quasi-stability deformation process. The Cu@GNPs@Al2O3/Cu composite exhibited optimal strength (YS: 290 MPa-0.45 vol% Al2O3, 300 MPa-0.76 vol% Al2O3), moderate ductility (18%), as well as far exceeding the toughness of the GNPs/Cu composites. Concurrently, the electrical conductivity of the composite remains at a high level of 96.5 IACS%. The present findings may provide a feasible strategy to optimize interfacial structure by adjusting the structure of reinforcement, which enables improved comprehensive properties of the Cu matrix.
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