Abstract

Abstract High-quality amorphous silicon-nitrogen alloys (a-SiN x ) have been deposited at room temperature by a sputtering-type electron cyclotron resonance (ECR) plasma. A detailed analysis of the properties of a-SiNx films in terms of their composition, microstructure and dielectric characteristics was performed using X-ray photoelectron spectroscopy, infrared (IR) spectroscopy and ramp current-voltage measurement techniques. Their characteristics were correlated with the N2 gas flow rate (NGFR) in the ECR plasma formation. The dependence of solid-state [N]/[Si] ratios in the films on the NGFR indicated that the film composition changed from non-stoichiometry to stoichiometry as the NGFR increased from 0.5 to 1 seem. The dependence of the IR spectra on the NGFR indicated that silicon nitride network was well ordered for an NGFR of 1 seem, in which the dielectric breakdown-field was over 4 MVcm−1. However, when the NGFR was over 1 seem, significant N≡N triple bonds (gaseous N2 molecule) were formed ...

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.