Abstract
A thickness gradient interpenetrating polymer network (IPN) was easily created that takes advantage of the relatively poor compatibility and curing rates discrepancy between epoxy (EP) and polyurethane (PU). Ultraviolet absorption spectrum (UV-Vis), thermogravimetric (TG), Differential scanning calorimetry (DSC), Dynamic thermomechanical analysis (DMA), Atomic force microscope (AFM) and water contact angle were adopted to characterize this IPN structure. We found that the absorption in visible light region, glass-transition temperatures (Tg), thermal decomposition temperatures (Td) and Derjaguin–Muller–Toporov (DMT) modulus were increasing along with the gradient direction from bottom side to top side of the IPN. While the absorption in ultraviolet region and adhesion force were decreasing along with the gradient direction from bottom side to top side of the IPN. DMA analysis demonstrates that this continuous gradient IPN has a good balance between the damping temperature range and the loss factor which is suitable for using as a self-supporting damping structure.
Highlights
Polymers have been a promising damping materials because of their good damping capacity to decrease noise and vibration within their range of glass-transition temperature (Tg ) [1,2]
Because the UV-vis absorption shows different intensities along with the gradient direction of Because the UV-vis absorption shows different intensities along with the gradient direction of the interpenetrating polymer network (IPN), it can be used for detecting the gradient structure
Dynamic thermomechanical analysis (DMA) analysis demonstrates that this continuous gradient IPN has a good balance between the damping temperature range and the loss factor which is suitable for using as a self-supporting damping structure
Summary
Polymers have been a promising damping materials because of their good damping capacity to decrease noise and vibration within their range of glass-transition temperature (Tg ) [1,2]. The limited damping temperature range ∆T (usually covers 20–30 ◦ C), the low storage modulus E0. (less than 1 GPa) and the mismatch between the working frequencies and actual required frequencies limit the applications of polymers as damping materials in engineering [3]. Damping polymers must be attached onto substrates to work as free damping or constrained damping structures instead of being singly used as structures until now [10,11,12]. The serious mismatching of modulus between polymers and substrates might cause some interfacial problems such as stress concentration and joint failure after periods of vibration.
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