Abstract
AbstractDue to the high‐power environments of electronic components, achieving the exceptional dielectric properties and mechanical behavior necessary for electronic packaging materials presents a significant challenge. In this study, a trifunctional maleimide (HTMI) was synthesized by reacting hexamethylene diisocyanate trimer (HDI trimer) with Maleic anhydride (MA), followed by the preparation of Bismaleimide (BMI) resin featuring a micro‐branching structure through its reaction with diallyl bisphenol A (DBA) ether and BMI. The intentionally designed micro‐branching structure resulted in an increase in the free volume within BMI, leading to an 8.8% reduction in the dielectric constant. Additionally, this micro‐branching architecture imparted superior mechanical properties to the BMI resin, as demonstrated by a 140% increase in bending strength and a 149% increase in impact strength of the cured product.
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