Abstract
This paper proposes a new compact thermal model (CTM) for the microprocessor package based on a one-dimensional thermal network with average temperature nodes. Different from the two-resistor model and the DELPHI model, the proposed CTM doesn't assume an isothermal surface, but sets plate heat sources along the top surface of the silicon die and the bottom surface of the solder balls layer. It is found that the temperature prediction result by a thermal network with the proposed CTM matches the three-dimensional heat conduction simulation result closely through a numerical experiment of a microprocessor system with a heat sink fan.
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