Abstract
This paper presents the results of an analytical and computational study of the contacts and interfacial fracture associated with the cold welding of Organic Light Emitting diodes (OLEDs). The effects of impurities (within the possible interfaces) are explored for contacts and interfacial fracture between layers that are relevant to model OLEDs. The models are used to study the effects of adhesion, pressure, thin film layer thickness and dust particle modulus (between the contacting surfaces) on contact profiles around impurities between cold-welded thin films. The lift-off stage of thin films (during cold welding) is then modeled as an interfacial fracture process. A combination of adhesion and interfacial fracture theories is used to provide new insights for the design of improved contact and interfacial separation during cold welding. The implications of the results are discussed for the design and fabrication of cold welded OLED structures.
Highlights
There has been significant interest in the fabrication of organic electronic structures using cold welding techniques.[1,2,3,4,5,6] Cold welding or cold pressure welding has been described as a process by which clean surfaces are brought together to achieve intimate contact, and thereby form strong bonds at the resulting interfaces.[7]
This paper presents the results of an analytical and computational study of the contacts and interfacial fracture associated with the cold welding of Organic Light Emitting diodes (OLEDs)
The adhesion energies and layer dimensions may affect the surface contacts and pull-off forces associated with the lift off stage of cold welding, which may be considered as an interfacial fracture process, as in recent work on the lamination of organic electronic structures.[3,23,24,25,26]
Summary
There has been significant interest in the fabrication of organic electronic structures using cold welding techniques.[1,2,3,4,5,6] Cold welding or cold pressure welding has been described as a process by which clean surfaces are brought together to achieve intimate contact, and thereby form strong bonds at the resulting interfaces.[7]. They have focused largely on the effects of stiff impurities on contacts induced by the application of pressure It is quite possible for the moduli of interfacial impurities (silicon, silicon oxide and organic materials) to vary significantly.[23] The adhesion energies and layer dimensions may affect the surface contacts and pull-off forces associated with the lift off stage of cold welding, which may be considered as an interfacial fracture process, as in recent work on the lamination of organic electronic structures.[3,23,24,25,26]. In this paper, we present the results of a study of the pressure-associated contact and lift-off stages that are associated with the cold welding of Au, Ag and other organic layers used in OLED structures.
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