Abstract
A new surface-micromachined capacitive single chip pressure sensor for high temperature applications using separation by implantation of oxygen (SIMOX) substrates is presented. The production steps are CMOS-compatible and allow on-chip integration of high temperature readout electronics. Measurements have been performed in a temperature range from 50°C to 340°C. Three different types of sensors have been investigated with a pressure range of 38, 85 and 125 bar. In the temperature range from 50°C to 250°C, the offset temperature coefficient (TCO) of the sensors is below the measurable accuracy. In the temperature range from 250°C to 340°C, the TCO falls off to −5000 ppm/°C due to induced stress of the package. Sensors that are released from the package show a maximum TCO of less than 500 ppm/°C over the whole temperature range.
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