Chip corrosion in plastic packages

Abstract

The corrosion performance of both unencapsulated and plastic encapsulated parts has been studied under temperature-humidity-bias (THB) stresses using a patterned test chip with aluminum metallization. The effect of encapsulation materials and ionic contaminants purposely introduced on the chip surface has been determined for both accelerated THB and severe, real life conditions. Unencapsulated test chips exhibited very different THB performance characteristics from encapsulated parts including a near-zero induction time and a shallow post-induction slope on the % failures vs time curve. The induction time and mean-time-to-failure (MTF) for encapsulated devices were strong functions of both the polymeric class of encapsulant and the particular compound employed. At least part of the difference in performance between molding compounds has been attributed to impurities inherent in the compounds. Impurities contributed from conductive epoxies used for die attach also adversely affect the device's MTF, as do normal contaminants present on as-plated leadframes. The environmental factors of temperature, relative humidity and bias greatly affect the performance of encapsulated devices. In this study, the MTF decreased dramatically with bias between 5 and 30 volts, the range over which most devices operate. The acceleration factors relating device performance in an 85°C/85%RH environment to severe, real life conditions were surprisingly small and somewhat dependent on the encapsulant.