Characterization of the thermosonic wire bonding technique. [Combination of ultrasonic energy and thermocompression

Abstract

This study was designed to evaluate the combination of ultrasonic energy and thermocompression techniques with regard to the bond response of thin film substrate metallization and thick film discrete component terminations. The object was to determine not only the quality of thermosonic gold wire bonds and the performance of these bonds when subjected to thermal environmental tests, but also to determine the process control parameters necessary to produce repeatable, reliable bonds. Comparison was made throughout the study with regard to results previously achieved on the same metallization systems using standard fine wire themocompression bonding techniques. It was concluded that the thermosonic wire bonding technique offered the advantages of lower bonding forces and lower substrate temperatures compared to the thermocompression process. In addition, it was determined that the thermosonic technique eliminates the need for special pre-bond etching and cleaning procedures presently used in production of Sandia hybrid microcircuits. Finally, a wide latitude in bonding parameters was realized with the thermosonic technique, and this was considered advantageous compared to the rigid process controls necessary for thermocompression bonding. (auth)