Abstract
Advancements in electronics technology that operate at cryogenic temperature require the study of thermal properties of the materials and interfaces used to connect these systems to a source of cooling. A test facility has been developed to investigate thermal properties important to these applications, bulk conductivity and contact resistance, over the temperature range from 4 K to 40 K. Bulk conductivity tests were conducted on OFHC copper sourced from three different commercial vendors to determine the degree of variation between the commercial sources and the level of agreement with the values found in literature. Preliminary analysis found RRR values within the range of 50 to 75 for all sources examined. These results are in line with previous studies and confirm the consistency of copper conductivity regardless of the source. The contact resistance tests focus on measuring the variation of contact resistance with applied force over the range from 90 N to 161 N for gold-plated OFHC copper samples with surface roughness in the range of 1 to 2 micrometer. Results from these tests will provide insight into the significance of force on contact resistance. The results from both tests will help guide the design of heat paths in future cryogenic electronic technology.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IOP Conference Series: Materials Science and Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
