Abstract

AbstractThere is great interest in using advanced mechanical characterization techniques, such as Digital Image Correlation (DIC), to investigate complex fracture behavior of fiber-reinforced composites. In this study, unidirectional carbon fiber/epoxy composites were fabricated from the pre-preg carbon fiber epoxy tapes for the characterization of their energy release rates. Quasi-static mixed-mode fracture experiments were performed using a Wyoming Test Fixture. The crack tip response of the composite was determined by using the displacement fields obtained from DIC based on LEFM. The fracture parameters obtained from the DIC analysis have been compared to those determined from the global load displacement response using ASTM standard. The results show that the experimental investigation of the energy release rates using more local, near field displacements around the crack tip obtained by DIC provide accurate quantification of the crack tip response relative to the global loading conditions. Effects of global bending and fixture compliance on the global load–displacement response can also be eliminated by using full-field DIC measurements.KeywordsEnergy Release RateDigital Image CorrelationCrack Opening DisplacementLinear Elastic Fracture MechanicFracture ParameterThese keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.