Characterization of bagasse‐rind particleboard bonded with chitosan

Abstract

AbstractThe development of high‐performance non‐wood lignocellulosic board without using synthetic adhesives derived from fossils resources is very important for the future. In this study, the characterization of bagasse particleboard bonded with chitosan was investigated. The 4 wt % chitosan‐acetic acid solution was sprayed onto bagasse rind particles at a 2–10 wt % chitosan solid content based on the dry particles. Particleboards with target densities of 0.75 and 0.9 g/cm3 were manufactured using a steam‐injection press. The steam pressure and total pressing time were 1 MPa (180°C) and 7 min, respectively. The addition of 2–4 wt % of chitosan was the most effective in the bending properties. The high‐density board bonded with a 4 wt % addition of chitosan showed a good result in the internal bond strength test. Furthermore, the board had favorable dimensional stability in dilute acetic acid as well as in a cyclic accelerated aging test. Judging from the analysis of bagasse extract‐added chitosan films, it was suggested that chitosan reacted with extract from bagasse during steam‐injection pressing. The reaction seemed to contribute to the board's good resistance to dilute acid. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009