Abstract
AbstractPolyamide resins, from a dimeric acid mixture, have been interacted with low‐molecular‐weight resins with terminal epoxy groups. The reaction mechanisms of the primary and secondary amino groups of the polyamide resins with the epoxy groups are discussed. Comparison is made with the reaction conditions and the properties of the resultant blends when epoxy resins are interacted with amine hardening agents.The polyamide‐epoxy thermoset blends are highly adhesive, partly due to the high concentration of polar groups, and have unusual flexibility because of the high degree of internal plasticization due to the fatty character of the polyamide resin. The physical properties of various blends are tabulated, and their current and prospective uses discussed.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
