Abstract
In the paper, we introduce thermal, electrical and long term reliability characteristic of insulated metal substrate (IMS) and comparing to the conventional DBC+Baseplate structure. Thermal performance is determined by junction to case thermal resistance, and the result shows that the thermal resistance of aluminum base IMS is reduced about 2.7% compared to conventional structure. Moreover, copper base IMS can reduce another 18% of thermal resistance. In Q3D simulation, the stray inductance of IMS is smaller than conventional structure about 43%. From the reliability point of view, thermal cycle test is also performed for 200 cycles which temperature range from $-65 ^{\circ}{C}$ to $150 ^{\circ}{C}$ with dwell time 30 minutes. DBC+Baseplate structure generate severely delamination under CSAM inspection in first 50 cycles. In contract to DBC+Baseplate, IMS shows no defect to the end of the experiment.
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