Abstract
High-k HfO2 thin films were assessed as a gate dielectric for possible oxide thin-film transistor applications. A HfO2 gate dielectric layer was deposited by radio frequency magnetron sputtering (RF-MS) of a sintered ceramic target at the working pressure of 5 mTorr and annealed at various annealing conditions. X-ray diffraction (XRD) and UV-Vis transmission spectroscopy were carried out to determine the structure and optical transparency of the sputtered HfO2 films, respectively. The electrical characteristics of the HfO2 films were evaluated using the metal-oxide-semiconductor (MOS) capacitor structure of Ti/HfO2/n++-Si. The capacitance-voltage (C-V) and current-voltage (I-V) measurements were taken using an impedance analyzer (Keysight, E4990A) and semiconductor parameter analyzer (Keithley, 4200-SCS), respectively. A dielectric constant of up to 8 with a leakage current as low as 1.0 × 10−9 A/cm2 at 2.0 V were observed.
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