Abstract
For a flip-chip package assembly, current crowding occurs in the vicinity of the locations where traces connect the solder bumps. This feature contributes significantly to the electromigration failure of the solder bumps. In this study the finite element analysis is performed to investigate characteristics of current crowding in a flip-chip solder bump subjected to a constant applied current. It is found that under such a condition, current crowding is induced solely by the structural geometry of the system. It is independent of the magnitude of the applied current. A volumetric averaging technique is also applied to cope with the current crowding singularity.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
