Abstract

Abstract The properties of piezoresistive tantalum nitride thin films on silicon substrates have been investigated for use in a pressure-sensing element. The thin-film deposition has been carried out by reactive sputtering techniques under d.c. and r.f. power conditions. An r.f. reactive sputtered tantalum nitride thin film in an Ar-9%N2 deposition atmosphere has been selected as the ideal piezoresistive material for the strain gauge. This piezoresistive strain gauge combines a high resistivity, ϱ = 230 μΩ cm, a low temperature coefficient of resistance, TCR= − 80 ppm/°C and a high temporal stability with a good longitudinal gauge factor, GF = 3.5.

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