Abstract
Significant efforts have recently been made to investigate flow boiling in microchannels, which is considered an effective cooling method for high-power microelectronic devices. However, a fundamental understanding of the bubble motion and flow reversal observed during flow boiling in parallel microchannels is lacking in the literature. In this study, complete numerical simulations are performed to further clarify the boiling process by using the level-set method for tracking the liquid–vapor interface which is modified to treat an immersed solid surface. The effects of contact angle, wall superheat, and the number of channels on the bubble growth, reverse flow, and heat transfer are analyzed.
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