Abstract
Liquid polyborosilazane, solid polyborosilazane, Si, and Sb2O3 were used as inorganic fillers to prepare low-temperature-cured and high-temperature-applicable polyborosilazane adhesive films. The mechanical properties of the bonded C/C composites were tested at 25 °C after treatment at different temperatures from room temperature to 1400 °C. The results showed that the addition of Sb2O3 significantly improved the mechanical properties of the adhesive, which was mainly due to the formation of borosilicate glass in the high-temperature melting decomposition system of Sb2O3, and the oxidation produced volume compensation. The shear strength of the bonded specimens gradually decreased from 12 MPa at curing to 4.18 MPa at 600 °C; then it increased up to 8.06 MPa at 1000 °C. When the temperature exceeds 1000 °C, the value decreases again. In general, the bonding strength of C/C composites at 1200 °C remains above 4 MPa. The adhesion strength of Si-modified polyborosilazane adhesive film was 4.88 MPa at 1000 °C, indicating that it should be suitable for joining C/C composites for high-temperature applications.
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