Abstract
Additive manufacturing based on liquid resin curing is one of the most promising methods to construct delicate structures. However, precision and speed are limited by the vertical adhesion of in situ cured resin at the curing interface. To overcome the unavoidable adhesion and to develop a general curing interface, we propose a slippery surface taking inspiration of the peristome surface of the pitcher plant. Such surface shows ultra-low adhesive energy at the curing interface due to the inhibition of the direct contact between the cured resin and the solid surface, which also increases the refilling speed of liquid resin. This ultra-low adhesive energy interface is effective for continuous 3D printing and provides insights into the physical mechanisms in reducing vertical solid-solid interfacial adhesion.
Highlights
Additive manufacturing or three-dimensional (3D) printing rapidly turns computer-aided designs into complex 3D objects on demand
According to the UV projection direction, Digital Light Processing (DLP) 3D printing can be divided into top-down DLP 3D printing, where the curing process occurs at the top liquid resin-air interface, and the bottom-up 3D printing with liquid resin curing at the liquid-solid interface at the vat bottom
The motivation of our work is to reveal the intrinsic problem of interfacial adhesion and develop a general 2D curing interface for 3D printing
Summary
Additive manufacturing or three-dimensional (3D) printing rapidly turns computer-aided designs into complex 3D objects on demand. Among 3D printing, Digital Light Processing (DLP) is considered as one of the most promising technologies for scalable process as it can allow each slice of 3D model to be solidified at the curing interface simultaneously by using a digitally projected illumination pattern [20, 21]. The bottom-up configuration is more widely used Even though they are effective in constructing high resolution structures in X-Y plane, such bottom-up DLP based additive manufacturing methods still have to overcome several critical challenges, such as limited process speed due to repeated pulling up and down process, low Zaxis resolution, and anisotropic mechanical property, which are essentially originated from the adhesion at the curing interface
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