Abstract
This paper describes the design and process of fully-integrated multilayer MEMS chips, including mm-sized wobble motor and actuator, with potential application in high density data storage [I]. We use a stencil plating process to fabricate fully-integrated rnultilayer high-aspect-ratio (10:1) metal structures a few tens of /spl mu/m thick with in-plane dimensions of a few millimeters. We implement integrated wobble motors with notches in stator and axle for process robustness, with wobble absorbers to reduce wobbling amplitude. The demonstration of full integration of mm-sized motor and actuator with large load carrying capability points to a low-cost path for shrinking data storage devices.
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