Abstract
Space applications require being able to pass 100% pull test, before and after thermal aging, and to conform to visual inspection. Gold thermosonic wirebonding (ball bonding) on Aluminum metallized silicon dies, is usually felt to be a sensitive process, due to the need for effectively controlling intermetallic. As the criteria are very stringent, the process setup of small batches can be a cumbersome and costly operation. In this paper, we propose an original sequence of methods to ensure correlation of success in all these aspects, while using only a pull tester and keeping the batch setup time and cost down. It relies on design of experiments (DoE) and analysis of variance (ANOVA), to estimate the effects of significant factors and determine an optimum. An original statistic is used to better answer the objective. The visual aspects of the bonds are also studied. The purpose is to offer a process map showing safe bonding conditions, where changes made to improve visual aspects will not impact the pull test values. Finally, we have quantified the visual quality, and have related it to the pull test.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of Microelectronics and Electronic Packaging
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
