Backside preparation and failure analysis for packaged microelectromechanical systems (MEMS)

Abstract

Failure analysis tools and techniques that identify root cause failure mechanisms are key components to improving MEMS technology. Failure analysis and characterization are relatively simple at the wafer and die level where chip access is straightforward. However, analysis and characterization of packaged parts or components encapsulated with covers, caps, etc may be more cumbersome and lead to problems assessing the root cause of failure. This paper will discuss two methods used to prepare the backside of the package/device to allow for failure analysis and inspection of different MEMS components <b>without</b> removing the cap, cover, or lid on the device and/or the package. One method for backside preparation was grinding and polishing the package for IR inspection. This method involved backfilling the package cavity with epoxy to hold the die in place. The other method involved opening a window through the backside of the package, exposing the die for IR inspection. Failure analysis results showed both methods of backside preparation were successful in revealing the failure mechanisms on two different MEMS technologies.