Abstract

The quality of solder joints on printed circuit board (PCB) is directly related to the reliablity and stablity of electronic products. How to ensure the quality of solder joints? One necessary step in production is the inspection of defective solder joints. In this paper, an automatic holographic interferential inspection method on PCB solder joints is presented. Based on this method, the inspection system ,which includes three parts -- Optic imaging system(OIS), Automatic control system(ACS) and Processing and recognition system(PRS), has also been discussed. A series of interferential fringe image processing algorithms are put forward and discussed at the end of the paper.

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