Abstract
SummaryA series of Hadamard designed experiments were used to evaluate the high aspect ratio plating capabilities and opportunities for extending that capability at the Tektronix Forest Grove Circuit Board Manufacturing Division. The investigation employed IPC-A-39 artwork to explore the effects of various factors in the electroless copper, electrolytic copper, and tin plating processes on electrical opens in small holes. Failed through holes were also examined using standard metallurgical techniques. The results showed: 1) The tin etch resist was the primary source of failures within the Tektronix plating process.2) Higher current density in the bright acid tin process and replacing bright acid tin with matte tin significantly reduced the number of failures.3) None of the factors tested for the electroless copper process had any impact on the number of failures.
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