Abstract
This paper describes the objectives and results of a joint European project named FLYING WAFER. The goal of the project was to provide a methodology for interlinking European R&D centers in micro and nano technologies to a distributed 300-mm CMOS R&D line. The project was carried out as a feasibility study. Therefore, the results provide a model and concept which has the potential of guaranteeing a safe and fast exchange of wafers and data between European R&D nodes to allow multisite processing. An implementation phase is planned as a second step.
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