Abstract
Fuzzy logic is a mathematical theory of inexact reasoning that allows modeling of the reasoning process of humans in linguistic terms, and it is an effective method approved to deal with the fuzzy objects in many areas of engineering application. The purpose of this paper is to explore the relationship between grinding process parameters and surface quality parameters of sapphire wafer by using fuzzy theory and to obtain optimization parameters to enhance the processing efficiency and higher the surface quality of the sapphire in ultra-precision grinding. This paper sets up the triangular fuzzy logic model between processing parameters and surface quality parameters for precision lapping of sapphire, and 2 groups of optimization parameters are selected. Finally, the experimental results verified that the optimization parameters of sapphire lapping obtained by using fuzzy logic which can improve the grinding efficiency and the surface quality of sapphire.
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