Abstract

Applied materials played a pivotal role in the commercial acceptance of rapid thermal processing (RTP) within the semiconductor industry, largely by solving the problem of precisely measuring and controlling the temperature of silicon. Today, our RTP-based products are used for processes as varied as radical oxidation, gate oxide engineering, metal silicide annealing, and ultra shallow junction annealing spanning the temperature range from 240degC to over 1200degC. The next generation RTP - millisecond annealing - is following the same trends by providing the most production worthy yet technically capable tool in the world.

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