Abstract
In semiconductor manufacturing, time-to-market is critical to maintain a competitive advantage through achieving customer satisfaction. Inefficient ways of utilising production resources will lead to a long cycle time. Therefore, machine allocation becomes an essential production decision in many practical manufacturing systems, especially for integrated circuit (IC) packaging. IC packaging is the process of encasing the finished die in a package in order to prevent corrosion and physical damage. Advanced IC packaging techniques add even more complexity into the production system, so reliable average cycle time of this complex system becomes difficult to obtain. We propose a new simulation optimisation framework with multi-fidelity models to study an IC packaging case of the machine allocation problem to pursue a minimum average cycle time. This framework consists of two methodologies: ordinal transformation (OT) and optimal sampling (OS). The OT first employs the low-fidelity model to fast observe all designs, and extracts insightful information from this model by transforming the original design space into an ordinal space. It follows that OS efficiently allocates the computing budget for searching the best design via high-fidelity simulations. An empirical study based on real data was conducted to validate the practical viability of the proposed framework.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
More From: International Journal of Simulation and Process Modelling
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.