Abstract
AbstractThis study presents an analytical model to calculate the stop band of the electromagnetic bandgap (EBG) materials embedded in PCB power/ground plane to mitigate power/ground plane noise. By treating the EBG structure as lumped elements at each unit, the currents flowing through the EBG patches may be analytically computed for the modes in the power/ground plane. An analytical model is derived based on the superposition of the local EBG currents' effects on the modal field distribution in the substrate. Comparisons with measurements are also presented to validate the derived model. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 835–838, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22296
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