Abstract
Conventional methods of cooling are not an ideal way to overcome the heat problem in power electronics today. A simple solution would be using micro heat spreader as an integrated part in the silicon substrate. This investigation presents a detailed analysis on maximum heat transfer capabilities of silicon-water cooling devices, flat plate micro heat spreaders. The predictive hydraulic and thermal models were developed to define the heat spreader thermal performances and capillary limitations. Theoretical results of the maximal heat flux that could be transferred agreed reasonably well with the experimental data and the developed model provides a better understanding of the heat transfer capability of micro heat spreaders.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
