Abstract
Power and ground planes are required to have low impedance over a wide range of frequencies. Parallel ground and power planes in multilayer printed-circuit boards exhibit multiple resonances, which increase the impedance. Dissipative loading of the radial transmission line structure of the planes reduces the resonance peaks. The dissipative loads can be realized by resistors distributed on the surface or the edges of plain pairs and lossy dielectric material can be applied for distributed loading, and the characterization of the impedance by simulation is very important during the design phase. Measurement results are compared with analytical solutions and simulation results. Furthermore, in this paper, a new algorithm is given for the more efficient calculation of the impedance of power distribution structures.
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