Analytic modeling and validation of strain in textile-based OLEDs for advanced textile display technologies

Abstract

In the IoT era, the demand for wearable displays is rapidly growing, catalyzing the advancement of research into textile-based organic light-emitting diodes (OLEDs). This growing interest stems particularly from the inherent flexibility of textile-based OLEDs1,2, allowing for seamless integration into the dynamic and interactive functionalities of cutting-edge wearable technology, alongside their superior electrical performance. The durability and mechanical robustness of these displays, especially under physical stress and deformation, are critical to their practical application and longevity. Thus, understanding and enhancing the mechanical properties of textile-based OLEDs is paramount for their successful integration into wearable technologies. However, many studies assessing the mechanical properties of OLEDs have predominantly relied on simplistic bending test outcomes determined by the radius, often neglecting or insufficiently analyzing the strain exerted on the OLEDs atop textile substrates in relation to curvature of these devices. Existing analyses typically presume pure bending, though such an assumption leads to considerable errors in strain estimations, making such approaches problematic if the goal is practical application in actual wearable display products. To address these limitations, an analytic model that includes a comprehensive energy equation is introduced, considering the stretching energy, bending energy, and shear energy of each layer composing the textile substrate. This holistic approach provides a novel formula specifically designed to calculate the top surface strain of textile substrates. Robust validation of this formula is conducted by comparing its results with strain measurements obtained from digital image correlation (DIC) and finite element analysis (FEA) outcomes from ANSYS across various bending radii (or equivalently, curvatures). The close alignment of the calculated strain values with those derived from DIC and FEA not only underscores the precision of this formula but also highlights its significant potential for enhancing the designs and functionalities of future wearable display technologies under real-world conditions.