Abstract
In this article, the influence of shrinkage tensile stress in potting materials on the anti-overload performance of a circuit board was studied. Firstly, the phenomenon of shrinkage tensile stress in common potting materials was analyzed, and it was found that the commonly used potting adhesives displayed large shrinkage characteristics. Secondly, a small experiment was set up to verify that the shrinkage tensile stress of potting adhesives would lead to printed circuit board (PCB) deformation, and the shrinkage stress was contrary to the acceleration direction of overload. Thirdly, the influence of potting adhesives on the overload resistance of the PCB was analyzed. However, the shrinkage tensile stress in the potting adhesive weakened the anti-overload ability of the circuit board. When there was a small amount of expansion stress in the potting adhesive, the overload resistance of the circuit board could be partially increased. From the analysis, it is indicated that a material with a certain expansion property, elasticity, and dense structure should be selected as the potting adhesive. This article provides a reference for improving the overload resistance of electronic devices.
Highlights
Micro-inertial navigation electronic devices have widespread application in the national economy and military fields
The results demonstrate that the anti-overload ability of the printed circuit board (PCB) which is parallel to the overload direction is affected by the internal stress of the potting adhesive
This article carried out research on the influence of potting adhesives’ shrinkage internal stress on the overload resistance of a circuit board
Summary
Micro-inertial navigation electronic devices have widespread application in the national economy and military fields. Many scholars have studied how to improve the anti-overload performance of devices, including rubber damping, potting resin adhesive, and other methods. Q. et al [12] investigated the packaging status of an accelerometer under a high-overload environment and found that epoxy resin has a good effect as a potting adhesive. The research of the above scholars shows that potting resin adhesive is a good method to improve overload resistance. The parameters and curing process of the potting materials have different effects on the high-overload resistance. From the research of the above scholars, it can be seen that using a potting adhesive is an effective method to improve anti-high-overload ability. Polyurethane and epoxy resin materials have the advantages of high elasticity, strength, and insulation Their formulas can be changed for different densities, hardness, and strengths to achieve better performance. This article will focus on the impact of shrinkage stress on the anti-overload performance
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