Analysis of electric field electrode distribution on dielectrophoresis abrasive flow for polishing internal surface of ceramic workpiece

Abstract

For the polishing of the internal surfaces of thin-walled ceramic parts, a dielectrophoresis abrasive flow polishing (DAFP) method is proposed. A non-uniform electric field is applied on the outer wall of the ceramic part, and abrasives in polishing fluid are polarized in the region of non-uniform electric field. The polarized abrasives are moved to the internal surface of ceramic parts by dielectrophoretic forces, so that more abrasives will effectively participate in the process of polishing internal surface of the ceramic part. Theoretical analysis of the forces on the abrasive particle is carried out. The flow field and electric field of different electrode ratios are simulated using COMSOL, the optimal dielectrophoretic force coefficient (e1), and thickness of active layer (δ3 = 2.15 mm) can be obtained when ER = 3. The original internal surface roughness of the workpiece is at 208 ± 5 nm. After 10 h of polishing, the roughness values of the inner surface of the workpiece reached 23 nm and 51 nm respectively, with and without dielectrophoresis. The efficiency of dielectrophoresis abrasive flow polishing of the inner surface of ceramic workpieces has been validated.