Abstract
A two-node model for thermal characteristics and a dynamic model of High Altitude Super Pressure Balloon (HASPB) during ascending process are established. The thermal performance of HASPB during ascending process is analyzed. Several simulations are conducted under the same conditions with the real flight test. Results show that supercool phenomenon occurs during ascending caused by free expansion of gas, and the value is about 10-15 K. Once the balloon reaches the design height and becomes over-pressured, the temperature of balloon rises rapidly, and this adjustment process lasts for about 10 minutes. The real flight test to 20000 m validates the reliability of the two-node model.
Highlights
High Altitude Super Pressure Balloons (HASPB) has altitude-keeping and long duration abilities, which is a perfect observation platform and has been researched by many countries
The thermal characteristics and thermal control of balloon during its ascending process are the key technologies in HASPB design
Thermal performance of HASPB has been researched by many organizations around the world
Summary
High Altitude Super Pressure Balloons (HASPB) has altitude-keeping and long duration abilities, which is a perfect observation platform and has been researched by many countries. Thermal performance of HASPB has been researched by many organizations around the world. NASA[1] has developed several Pumpkin Balloons and studied their thermal performances deeply. Due to the high cost and complexity of flight tests, only few scholars and organizations around the world could obtain the real thermal data[7]. There are few papers that can use the real flight data to validate their models. A two-node model for the thermal characteristic of HASPB during ascending process is proposed. Some real thermal data, which was obtained by a balloon test in Ximeng City (China), are used to validate the accuracy of the two-node model. The simulation predicts that supercool phenomenon occurs during ascending process, which is confirmed by the real thermal data
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.